Datacon 2200 evo manual6/12/2023 ![]() Warning: Missing argument 4 for avia_woocommerce_gallery_thumbnail_description() in /home/csisemi/public_html/wp-content/themes/enfold/config-woocommerce/config. ![]() Designed to maximize accuracy and versatility, the FC150 answers almost every need in high-end bonding applications. Datacon evo High speed multi chip module assembly SiP stacked die / epoxy, spacer film and WBL (Wafer Backside Lamination) Thin die handling (down to below 30 m) Reticle (multi-project) wafers Fast product change due to recipe driven tool change Highest performance in the high end market, up to 7, UPH. material, support and automation for electronic manufacturers in the Nordic and Baltic countries and Poland. Warning: Missing argument 4 for avia_woocommerce_gallery_thumbnail_description() in /home/csisemi/public_html/wp-content/themes/enfold/config-woocommerce/config.php on line 1251 With configurations ranging from manual to full automation, the FC150 provides development and production capabilities on a single upgradeable cost-effective platform. ![]() Lumileds has successfully tested Datacon evo 2200 machine from Besi as. ![]() Warning: Missing argument 3 for avia_woocommerce_gallery_thumbnail_description() in /home/csisemi/public_html/wp-content/themes/enfold/config-woocommerce/config.php on line 1251 For manual handling, use ESD certified tweezers and apply minimal force on the.
0 Comments
Leave a Reply. |